April 20-21, 2026
Kuala Lumpur, Malaysia
optoelectronics@acmemeetings.com
OPTOELECTRONICS2026
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2D and Carbon-Based Semiconductors (Graphene, TMDs)
Emerging Memory Technologies (RRAM, MRAM, PCM)
Spintronics and Magnetic Semiconductor Devices
Flexible, Wearable, and Printed Electronics
Perovskites and Next-Generation Photovoltaic Materials
EUV and High-NA Lithography
Advanced CMOS Technologies (GAA, Nanosheet, Nanowire FETs)
Backend-of-Line (BEOL) Integration and Interconnect Innovations
Advanced Packaging, 3D ICs, TSVs, and Heterogeneous Integration
Chiplet Architecture and Multi-Die Integration
Reliability Engineering, Yield Improvement, and Failure Analysis
Thermal Management and Advanced Cooling Technologies
AI Accelerators, Neuromorphic Computing, and Edge-AI Chips
High-Performance and Energy-Efficient Computing Architectures
Quantum Computing Hardware and Cryogenic Electronics
RISC-V and Open Hardware Semiconductor Ecosystems
Silicon Photonics and Optical Interconnects
Terahertz, Infrared, and Nanophotonic Devices
LiDAR, Imaging Sensors, and AR/VR Optoelectronics
Plasmonics, Metasurfaces, and Photonic Nanostructures
Free-Space Optical Communication (FSO) and Li-Fi Systems
Photodetectors, Light Emitting Devices, and Next-Gen Displays
Power Semiconductor Devices for EV and Renewable Energy
Energy Storage Interface Electronics and Battery Systems
Smart Grid Electronics and High-Efficiency Power Systems
Green Manufacturing and Sustainable Semiconductor Processing
Semiconductor Recycling, Lifecycle, and Circular Economy
Supply-Chain Resilience, Geopolitics, and Semiconductor Policy
Security, IP Protection, and Hardware-Level Cybersecurity
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